Early investment in Bluetooth HDT, integrated RF capabilities and proven interoperability drive strong commercial momentum, with more than ten customers already licensing Ceva’s technology
ROCKVILLE, Md., Nov. 4, 2026 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today welcomed the introduction of Bluetooth® High Data Throughput (HDT), the next major advancement in Bluetooth technology. Delivering nearly four times the previous maximum Bluetooth throughput, along with increased capacity, better energy efficiency and enhanced reliability, Bluetooth® HDT enables a new generation of high-performance wireless applications. With more than ten customers already licensing its Bluetooth® HDT IP, Ceva is well positioned to accelerate adoption of this important new technology.
Introduced as part of the newly adopted Bluetooth® Core 7.0, Bluetooth® HDT expands the capabilities of Bluetooth Low Energy (LE) to support increasingly data-intensive applications. Its higher throughput and increased capacity create new opportunities for high-resolution and lossless wireless audio, immersive and spatial computing, AI-enabled devices and advanced industrial systems. By transferring more data in less time, Bluetooth® HDT also improves energy efficiency, while enhanced reliability supports more consistent wireless performance in increasingly complex environments.
Ceva began investing in Bluetooth® HDT technology well ahead of the specification’s completion, alongside a strategic expansion of its RF capabilities to deliver more comprehensive wireless connectivity solutions. In January 2025, the company introduced Ceva-Waves Links200, its turnkey multi-protocol wireless connectivity platform supporting Bluetooth® HDT. By combining its expertise in digital baseband and software with internally developed RF technology, Ceva now offers customers a complete Bluetooth® HDT solution spanning RF, baseband and protocol stack. Ceva has also advanced its technology through interoperability testing with other HDT chipset providers, helping customers accelerate development and reduce integration risk ahead of the specification’s adoption.
This early investment has translated into significant commercial traction. Among recent milestones, a leading U.S. semiconductor company licensed Ceva’s complete Bluetooth® HDT solution, including its internally developed RF technology, while Actions Technology introduced its ATS296X wireless audio SoC family incorporating Ceva-Waves Bluetooth® HDT IP. These achievements demonstrate the growing adoption of Ceva’s technology across next-generation wireless applications.
“Bluetooth® HDT represents a major step forward in wireless connectivity, enabling richer experiences and new possibilities across a broad range of connected devices,” said Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva. “Our early investment in HDT, combined with our expanded RF capabilities and proven interoperability, has positioned us to help customers bring this next generation of Bluetooth technology to market. With more than ten customers already licensing our technology, we see strong momentum behind the adoption of higher-performance Bluetooth solutions.”
Ceva’s comprehensive Ceva-Waves wireless connectivity IP portfolio includes Bluetooth® HDT, Bluetooth LE and Dual-Mode (LE+Classic), alongside Wi-Fi and Ultra-Wideband (UWB), supported by integrated hardware and software solutions, including multi-protocol turnkey Radio Subsystem platforms with embedded RF. These technologies underpin the Connect pillar of Ceva’s strategy to enable devices to Connect, Sense, and Infer as part of the broader industry shift toward Physical AI. Licensed by leading semiconductor companies worldwide, Ceva’s wireless connectivity IP is deployed in billions of devices.
For more information on Ceva’s Bluetooth platform, visit https://www.ceva-ip.com/product/ceva-waves-bluetooth/.
About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today’s most advanced smart edge products – from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva’s IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
SOURCE Ceva, Inc.
