M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets
HSINCHU, Sept. 23, 2026 /PRNewswire/ -- M31 Technology (M31), a global silicon intellectual property (IP) provider, and Ambiq, a technology ...
Tag: Semiconductors
Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design
New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff Certified EDA ...
PATEO Signs Strategic MoU with Arm to Advance Physical AI Innovation
SHANGHAI, Sept. 22, 2026 /PRNewswire/ -- PATEO (02889.HK) recently signed a strategic cooperation Memorandum of Understanding (MoU) with Arm to ...
Valens Semiconductor to Collaborate with onsemi on a Cost-Optimized Integrated Sensor Based on the MIPI A-PHY Standard
Collaboration agreement to support the development of MIPI A-PHY solutions targeting high-volume 3MP automotive camera applications HOD HASHARON, Israel, Sept. ...
Aeonsemi Unveils Praxium™ Multi-Gigabit Ethernet PHYs for Physical AI
Ultra-compact, low-power 10G/5G/2.5G Ethernet PHY family brings standards-based connectivity and flexible cabling to robots, autonomous vehicles and intelligent machines SANTA ...
From AI Computing to Space Technology and Smart Sustainability 2026 TIE Pavilions Showcase Taiwan’s Innovation Capabilities
TAIPEI, Sept. 11, 2026 /PRNewswire/ -- The 2026 Taiwan Innotech Expo (TIE) will be held from September 17 to 19 at ...
Silicon Line®, une marque d’EverProX®, lance le nouveau chipset SerDes à très faible consommation MSDL™ (MIPI Serial Data Link), qui étend la connectivité MIPI D-PHY à 20 Gbit/s sur des distances de plusieurs dizaines de mètres
Une nouvelle solution optique/électrique regroupe deux flux simultanés de caméras MIPI-DPHY, pouvant atteindre 10 Gbit/s chacun, sur deux liaisons série, tout en ...
Arasan renforce sa conformité à la norme MIPI I3C® grâce à sa participation à l’événement d’interopérabilité I3C® à Taipei
Arasan Chip Systems annonce sa participation, les 19 et 20 octobre 2026, à la session d'interopérabilité MIPI I3C® organisée à ...
Arasan participa en el evento de interoperabilidad I3C® en Taipéi
-Arasan refuerza el cumplimiento de la norma MIPI I3C® con su participación en el evento de interoperabilidad I3C® en TaipéiArasan ...
Tulip Unveils Global Imaging Patent Licensing Program
Tulip Imaging provides access to more than 125,000 patents from Canon, Sony, Huawei, and OPPO covering foundational image and information ...
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